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  • Chiplet Summit 2024

    Chiplets connected via the Universal Chiplet Interconnect Express
    EDA

    Demonstrating the UCIe Chiplet Interconnect

    May 13, 2024
    Cadence's UCIe demo presents key features and interoperability support, and also discusses the future of chiplet technology in high-performance SoCs.
    Andrei Dzemidzenka, Dreamstime
    EDA

    Does This Chip Hold the Future of the Semiconductor Industry?

    April 3, 2024
    Learn more about Pike Creek and its potential implications as the first test chip featuring chiplets linked by the UCIe standard.
    How Chiplets Accelerate Generative AI Applications
    Machine Learning

    How Can Chiplets Accelerate Generative AI Applications?

    March 27, 2024
    This superpanel explores the role of chiplets in advancing ever-expanding generative AI technology.
    What will Chiplets Look Like in 2029?
    EDA

    Chiplets in 2029: How We Get There

    March 11, 2024
    Wrapping up the 2024 Chiplet Summit, this panel session discussed the huge advantages and persistent challenges presented by chiplets.
    Multi-Die Systems Set the Stage for Innovation
    EDA

    Multi-Die Systems Set the Stage for Innovation

    Feb. 21, 2024
    Abhijeet Chakraborty, Vice President of Engineering at Synopsys, in his keynote at the 2024 Chiplet Summit, said that last year was an inflection point for multi-die systems.

    More content from Chiplet Summit 2024

    91824901 © Forance | Dreamstime.com
    EDA

    EDA Helps Cultivate the Future of Die-to-Die Connectivity

    Feb. 8, 2024
    Explore Keysight’s Chiplet PHY Designer tool and the game-changing UCIe standard in chip design.
    Can Chiplets Solve Semiconductor Challenges?
    EDA

    Can Chiplets Solve Semiconductor Challenges?

    Dec. 13, 2023
    With the right investments, chiplets can help solve long-standing industry challenges such as increasing costs and supply disruptions, resulting in a world where devices are more...