Careful consideration of mechanical, hydraulic, power, and cost requirements helps determine the best thermal management solution for high-power applications.
Maintaining junction temperatures is essential for power and microprocessors at the p.c. board level. Tests now can compare forced convection heat transfer for swaged, mixed-metal heatsinks to help maintain these temperatures.
All thermal calculations aren't exactly equal, but they're close.
Even with all the hype about forced convection cooling, many applications in the electronics cooling industry still depend on natural convection cooling. The natural buoyancy of heated air allows designers to avoid active cooling (fans)...
A dry-to-the-touch thermal grease product offers the lowest thermal resistance at low closure force - with handling ease.
Heat pipes reduce the space required to ensure remote heat transfer, improve thermal efficiency, and add little weight to the solution.