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Ultra-compact IC package suits alternative energy applications

Ultra-compact IC package suits alternative energy applications

International Rectifier (IR) announces that it has expanded its packaging portfolio with the introduction of a PQFN 4 x 4 mm package featuring the latest high-voltage gate drive ICs that deliver an ultra-compact, high density, and efficient solution for home appliance, industrial automation, power tools, and alternative energy applications.

The new PQFN4x4 (modified MLPQ 16-lead) package can accommodate many of IR’s high-voltage gate drive ICs that formerly required packages as large as the wide-body SOIC-16, thereby offering an 85% smaller footprint. The new package is designed with the appropriate creepage and clearance requirements to enable reliable designs at voltages up to 600 V.

With a low profile of less than 1 mm, the PQFN4x4 package is compatible with existing surface mount techniques and is MSL2 rated and RoHS compliant. IR’s HVIC technology integrates N-channel and P-channel LDMOS circuitry in an intelligent driver IC. The ICs receive a low-voltage input and provide gate drive and protection features for HV power-conditioning applications.

Additionally, these monolithic HVICs provide integration of features and functionality to simplify circuit design and reduce overall cost, including the option to use a low-cost bootstrap power supply. This eliminates the need for the large, expensive auxiliary power supply that discrete optocoupler or transformer-based designs often require.

For more information, contact International Rectifier, 233 Kansas St., El Segundo, CA 90245. Phone: (310) 252-7105.

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