EET

Power management ICs suit point-of-load design

Texas Instruments Inc. announces two new power management integrated circuits for point-of-load designs that feature both power density and high performance. TI’s TPS82671 and TPS84620 integrated power solutions are designed to ease design and speed time-to-market in portable electronics, communications, and industrial applications.

The TPS82671 is reportedly the industry’s smallest integrated plug-in power solution at 6.7 mm2, providing 90 milliamps per square millimeter, according to company sources. The device combines all external components in TI’s new MicroSiP package with a 1-mm height, easing design for 600-mA portable electronics, such as smartphones. The TPS82671 operates at a very low 17-uA quiescent current and achieves power efficiency of greater than 90% from an input voltage of 2.3 to 4.8 V. A unique PWM frequency dithering feature reduces noise and improves performance in radio frequency-sensitive designs.

TI’s new 6-A, 14.5-V TPS84620 achieves a power density of greater than 800 watts per cubic inch with up to 95% efficiency and 30% better thermal dissipation than competitors, according to TI. The integrated step-down solution combines the inductor and passives onto one device, and requires only three external components, resulting in a complete solution in a space less than 200 mm2. The TPS84620 supports a variety of high-power telecom infrastructure and industrial systems that use DSPs and FPGAs.

For more information, contact Texas Instruments Inc., 12500 TI Blvd., Dallas, TX 75243. Phone: (972) 644-5580.

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