Semikron announces that it has reduced the amount of materials in its 6th-generation SEMIPACK modules, as well as improved its module protection, due to a new packaging concept. Target applications for the thyristor, thyristor/diode, or diode modules are input rectifiers (single-phase, three-phase, non-controlled, semi-controlled, or fully-controlled) for frequency inverters or UPS systems, lighting control systems in theaters, and temperature control systems in furnaces.
The thyristor-diode module SEMIPACK 1.6 uses less material and includes a fundamental change to the design of the internal module structure. This module now features spring pressure contacts, meaning chips can now be freely positioned on the substrate; additional internal connections are no longer needed, substantially improving reliability. In addition, the heat management in the electronic packaging concept has been optimized, resulting in the elimination of materials and solder layers and a clear reduction in thermal resistance. The maximum continuous current of the SEMIPACK 1.6 is now greater than in the previous-generation SEMIPACK 1.5.
The company also introduces its new protective packaging concept called SEMiSEAL in the SEMIPACK 1.6. The new packaging protects power modules by vacuum-sealing them between a plastic film and paperboard. The modules are automatically seal-packed once they reach the end of the production line and the final quality check has been done, and are reliably protected from harmful environmental influences such as contamination and humidity. SEMiSEAL helps ensure that modules are transported and stored safely, improving overall product quality.
For more information, contact Semikron Inc., 11 Executive Dr., Hudson, NH 03051. Phone: (603) 883-8102.