Molex Incorporated introduces its SpeedStack™ Mezzanine Connector System, a high-density, low-profile solution that supports data rates of up to 40 Gbps per differential pair. The system is ideal for OEMs that contend with limited PCB real estate in a variety of industries including telecommunications, networking, military, medical electronics and consumer technology. The mated stack heights of 4.00 to 10.00mm along with a 0.80mm pitch provides design engineers with the ultimate in flexibly to address space constraints without sacrificing performance.
The SpeedStack Connector System comes in multiple circuit sizes of 22, 44, 60, 82, 104 and 120 with a range of 6 – 32 differential pairs for even greater flexibility. The 100 Ohm design provides superior impedance control with an 85 Ohm version to be released in June 2013 that will support PCIe* Generation (Gen) 3.0 and Intel QuickPath Interconnect (QPI) requirements for next-generation I/O and memory signalling. The insert-molded wafer design includes a protective shrouded housing, providing support to the terminal location and improved electrical balance. A common ground pin helps improve electrical performance and minimize cross talk.