Rogers Corporation Advanced Circuit Materials Division launched COOLSPAN® that provides reliable high-temperature performance.
COOLSPAN TECA Film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings. The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical, or press fit metal attachment. This film provides both a thermally and electrically conductive bond interface.
COOLSPAN TECA Film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier. It is able to survive lead-free solder processing and offers outstanding chemical resistance and high temperature performance, helping you to keep things cool.
COOLSPAN TECA Film has been demonstrated to easily survive 5X lead-free solder exposures, 1000 hours at 85C/85%RH, and 190°C for 10 days.