Rogers Power Distribution Systems (PDS) launched new technology at APEC 2012 with RO-LINX® PowerCircuit™ bus bars, which provide multifunction capability in a single, compact form factor. PowerCircuit bus bars can distribute power and signal lines or have components mounted on the bus bar structures-saving space and weight. These three-dimensional (3D) capable structures are ideal for power distribution applications in EV/HEVs, wind/solar power, and variable-frequency-drive (VFD) markets.
PowerCircuit bus bars are solder-process compatible, and the highly integrated structures help engineers in the design of power and control circuitry while maintaining small circuit footprints.
Rogers direct bond copper (DBC) ceramic substrates and micro-channel coolers deliver outstanding voltage isolation, high thermal conductivity, and excellent heat-spreading characteristics for a wide range of power electronics applications, including power modules (such as motor drives and uninterruptible power supplies), automotive, and renewable energy (solar, wind). The high-performance substrates are made by bonding a bare copper layer with high heat capacity to different ceramics such as alumina (Al2O3) and aluminum nitride (AlN). Because DBC substrates feature temperature coefficients of thermal expansion closely matched to that of silicon, they support chip-on-board assembly while minimizing stress on silicon devices.
According to the company, these coolers can achieve four times more efficient cooling than traditional module structures with liquid cooling.