Conduction Cooled Frames Stand Up To Severe Environments

Dec. 1, 2000
Designed for circuit boards requiring cooling in severe environments where convection cooling is not possible, the Conduction Cooled Assemblies are standard-design frames, customized to match the board and application. They provide structural support

Designed for circuit boards requiring cooling in severe environments where convection cooling is not possible, the Conduction Cooled Assemblies are standard-design frames, customized to match the board and application. They provide structural support for high shock/vibration situations and can be configured for compliance to IEEE 1101.2 and VITA 30.1 if needed. Features include injectors/ejectors, corrosion-resistant platings, and a sandwich structure that minimizes stress due to the various coefficients of thermal expansion. Custom silkscreening is available as well as custom designs with integrated heat pipes.

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