International Rectifier’s IR140CSP FlipKY™ device, the smallest Schottky diode in the industry, uses standard ball-grid array (BGA) technology, and occupies a total area of 2.25 mm2, or 86% smaller than the standard SMA package, and as much as 32% smaller than similar competing leadless devices. The 1A, 40V Schottky diode is a 4-ball, 1.5 mm × 1.5 mm device with a profile of less than 0.8 mm. The FlipKY revolutionizes the low power Schottky diode market by eliminating the lead frame and epoxy traditionally used in other devices.
The FlipKY is ideal for handheld, portable equipment such as cell phones, PDAs, notebook computers, handheld computers, MP3 players, and hard disk drives.
BGA technology enables size reduction and better heat transfer away from the die junction to the circuit board. Moreover, since this device is made with true chip scale packaging, it dissipates heat directly from the die into the air, increasing thermal efficiency. In fact, thermal resistance junction-to-ambient is rated at 75°C/W maximum and thermal resistance junction-to-PCB is typically 55°C/W.
For more information, visit www.irf.com.