C&D Technologies CPS has won an award from Hewlett Packard in recognition of power supply development work carried out by its engineering team based in Portland, Ore. The team received the award following its development of a highly complex, high-density dc-dc converter to power Hewlett Packard’s 64-bit dual-core processors for enterprise servers.
The dual-chip packaging technology has been implemented in systems that enable Hewlett Packard to include twice as many processors than previously possible. The technology means that two separate processors share the same data pathway connecting them to the rest of the computer.
The award was presented to Dan Enzone of C&D Technologies CPS by Steve Rocha of Hewlett Packard. Commenting on the receipt of the award, Enzone said, “This award validates C&D’s capabilities to develop power products that support industry leading solutions for our customers. The development effort combined high-density packaging and an integrated thermal management system solution.” For more information, contact [email protected] or see www.cd4power.com.