LPKF Laser & Electronics AG (Garbsen, Germany) recently signed a corporation agreement with Harting Technology Group (Espelkamp, Germany). This partnership allows Harting to produce three-dimensional molded interconnect devices (3D-MIDs) for the micro-packaging field, using LPKF’s proprietary Laser Direct Structuring (LDS) process.
With this agreement, Harting will become a full-featured supplier of LDS made 3D-MID solutions. Harting will use and advance the LPKF LDS process, which consist of three easy steps. A structure is molded in a standard mold using the recently licensed Ticona Vectra® Liquid Crystal Polymer (LCP) material, then the desired interconnect pattern is then directly written on the resulting molded part using an LPKF laser system. The conductive paths are then plated using industry-standard methods. The plating adheres only where the plastic has been activated by the laser. Using this method, Harting can prototype and mass-produce micro-packaging solutions in-house. Micro packaging allows the realization of higher reliability standards, and greater functionality per volume through the process of miniaturization and component integration.
For more information, visit www.lpkfusa.com.