IQS, a provider of engineering and testing solutions, has announced a thermal management design group. The IQS thermal management design lab provides customers with the ability to model, design, develop and qualify cooling strategies for their products. In addition, the lab is designed to quickly and accurately diagnose and mitigate any potential thermal problem an existing product may have.
The goal is to identify and solve thermal issues by the first prototype stage of product development and verify the solution by production. With a primary goal of providing customers with a thermal solution that will not require changes once the product reaches manufacturing, large engineering change costs are avoided.
Examples of thermal projects include optimization and selection of air movers and heat sinks, pc board component layout direction, determination of critical device junction temperatures, product DVT (design verification and test) and optimized mechanical packaging designs. IQS also has a custom heatsink design capability that provides customer with component level thermal management. Typical applications include telecommunications equipment, personal computers, automotive, medical electronics and networking equipment.
Analytical and experimental thermal tools at IQS include CFD modeling software, mechanical design software, airflow test equipment, wind tunnels, environmental chambers, and a vast array of data acquisition tools. The IQS thermal design services group is not affiliated with any manufacturer, meaning IQS acts as an independent consulting and design resource entity. IQS can engage all providers of thermal solution products and recommend the best possible solution for design.
IQS also provides engineering services in the fields of product safety, emissions and compliance testing, including but not limited to NEBS, CE, UL, CSA and TUV.