Hirose has introduced the DF52 Series, a 0.8mm pitch wire-to-board connector that delivers up to 2.5 A per contact. With a height of only 1.75mm and a depth of 4.1mm, this miniature wire-to-board connector provides significant PCB space savings. The low-profile DF52 Series combines a compact design with a thick housing structure, ensuring high reliability and ruggedness in consumer, gaming, imaging, security and wearable applications.
The DF52 Series utilizes robust box-shaped crimp terminals that prevent snaring or breakage and stabilize the contact. The header terminals are C-shaped with two points of contact on the top and bottom. Offering low contact resistance via highly conductive materials, the DF52 Series is well-suited for high current applications.
In addition, the DF52 Series features a patent-pending design with slits in the housing that allow visual confirmation of mating completion and improves overall efficiency of assembly. The DF52 Series is rated up to 2.5 A maximum with 28 AWG for 2 positions. Multiple positions ranging from two to 20 are available.
The DF52 Series is RoHS-compliant, with an operating temperature range of -40°C to +85°C, a rated power voltage of 100V AC/DC, a rated power contact resistance of 10 mW, and an insulation resistance of 100 MW minimum at 100V DC.