Power Electronics
Thermal Transfer Sheet Offers Alternative to Thermal Pastes

Thermal Transfer Sheet Offers Alternative to Thermal Pastes

:ARCOL Resistors announces the availability of its TGR200 Thermal Transfer Sheet. TGR200 is a no-shrink, 100% coverage, no mess alternative to conventional thermal pastes which can be easily trimmed to required sizes with minimal wastage

TGR200 thermal transfer sheet is supplied as a flexible dry mat providing high performance heat transfer without the need for wasteful and messy assembly processes. The sheet offers fast, clean assembly and is capable of extended service life without degradation or shrinkage and, as it contains no oils, which also eliminates any risk of contamination.

ARCOL's TGR200 thermal transfer sheet has been designed as an alternative to thermal compounds and is available shaped to suit industry standard resistor packages or in cut lengths, rolls or sheets to best suit the end application and speed the assembly process. TGR200 is electrically conductive and ensures a thermally efficient transfer of heat between the mounted product and heat sink, has a nominal thickness of 0.2mm but other thickness are available on request, thermal resistance of <0.7 °C/W, thermal conductivity of 3.58 W/mK and is RoHS Compliant.

TAGS: Products
Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish