Power Electronics

High-Performance Silicone-Free Gap Fillers

   

The Tflex™ SF800 and Tflex™ SF200 are the latest addition to Laird Technologies’ thermal gap filler line. The introduction of these two new products expands Laird Technologies’ silicone-free gap pad selection. Tflex SF800 is a high performance gap pad with exceptional wetting characteristic, while Tflex SF200 features extremely low contact resistance for effective heat transfer. These products are naturally tacky on both sides and require no additional adhesive coating, allowing for exceptional thermal performance.

Both the Tflex SF800 and Tflex SF200 are offered in a variety of thicknesses to suit virtually any need. The SF800 has thermal conductivity of 7.9 W/mK, while the SF200 offers thermal conductivity of 1.8 W/mK or 2.0 W/mK, depending on thickness. These silicone-free gap pads are easy to handle in all available thicknesses while their natural tack allows for the pad to be held in place during assembly. Tflex SF200 is available with differential tack for easy assembly and rework. 

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