Power Electronics
Heat-Spring® Thermal Interface Material

Heat-Spring® Thermal Interface Material

Heat-Spring® is a patented technology from Indium Corp. designed to deliver superior performance compared to thermal greases or other metal TIMs. Heat-Springs® offer uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of the Heat-Spring minimizes surface resistance and increases heat flow. Heat-Springs® do not experience pump-out even under repeated power cycling.

Heat-Springs are available in a variety of alloys, such as Sn+, In, or InSn, and are offered in a variety of forms to meet the needs of any application.

 

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