Power Electronics

Direct Thermal Exchange Configurations for LED Assemblies

Direct Thermal Exchange (DTE) design in printed circuit boards intended for LED arrays provides a direct thermal path to the base metal of the assembly, allowing the high-power LEDs to dissipate heat effectively, extending their working life and safety in overall functioning. Electronic Interconnect (EI) now offers Direct Thermal Exchange for LEDs. Thermal Management designs and engineering are an area of specialization and focus for EI.

This is an important enabling technology for LED-bearing circuits, especially those intended for outdoor lighting and emergency vehicles where heat dissipation is an ever-increasing concern as the technology of high-power LEDs advances.

Any base metal thickness can be used, Patel adds, and any typical dielectric can be used, including FR-4, epoxy, and polyimide. Additionally, no PCB design change is required, so the technology can be implemented simply, quickly, and at minimum cost and without undue complications.

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish