Power Electronics
MicroSiP Power Modules

MicroSiP Power Modules

TI's new TPS82740A and TPS82740B step-down converter modules support 200-mA output current with 95 percent conversion efficiency and consume only 360 nA of quiescent current during active operation and 70 nA during standby. The tiny modules rely on a fully integrated, 9-bump MicroSiP package, which incorporates a switching regulator, inductor and input/output capacitors to achieve a solution size of only 6.7 mm2.

The TPS82740A supports output voltages from 1.8 V to 2.5 V, while the TPS82740B supports 2.6 V to 3.3 V in 100-mV steps, which can meet power requirements of microcontrollers, such as TI's new ultra-low power MSP430FR59xx microcontrollers (MCUs), and Bluetooth® low energy solutions, such as the SimpleLink™ CC2540T wireless MCU.

Key benefits of the TPS82740A and TPS82740B:

  • Smallest 200-mA DC/DC solutions: Fully integrated MicroSiP modules include all passives, and achieve a 6.7-mm2 solution size, 75 percent smaller than discrete solutions. 
  • Lowest power, highest performance: Operates at only 360-nA quiescent current and 70 nA during standby.
  • An integrated load switch and a 3-pin voltage select function optimize power consumption on the fly during operation.

The TPS82740A and TPS82740B MicroSiP modules expand TI's portfolio of ultra-low power battery management and DC/DC converters that help maintain longer battery life and even enable battery-free operation in low-power designs. The bq25570, bq25505, TPS62740, TPS62737 and TPS62736 power devices achieve the industry's lowest levels of active quiescent current.

The TPS82740A and TPS82740B power modules are shipping in volume production. Both modules come in a 2.3-mm by 2.9-mm by 1.1-mm MicroSiP package, and are priced at US$1.55 each in 1,000-unit quantities. Designers can order the TPS82740AEVM-617 and TPS82740BEVM-617 evaluation modules and download the PSpice transient module simulation software to simplify design and reduce development time.

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