AVX Corporation has released the new WBR Series thin film wire bond resistors. Diced to small 0202 chip outlines with extremely tight dimensional tolerances, WBR Series top-contact, bottom-isolated resistors are ruggedly constructed, rated for up to 250mW DC power, and deliver ultra-stable, high-reliability performance in low profile packages. The series also offers customizable resistive values with chip markings to match, in addition to film, substrate, termination materials, TCR values, and resistive tolerances. Designed for use in applications that require stable thermocompression, epoxy, or ultrasonic bonding attachment, WBR Series resistors are ideal for use in: hybrid circuits, medical implantable devices, multichip modules (MCM), test and measurement instrumentation, high-reliability microelectronics, and military and defense applications, amongst others. The series is tested to MIL-STD-202 MTD 106, 107, and 108, as well as MIL-PRF 55342.
Standard design and material options for WBR Series wire bond resistors include: 0202 chips with silicon or glass substrate material, silicon chrome (SiCr) or tantalum nitride (TaN) film, and bondable gold or aluminum terminations. Standard performance options include TCR values: ± 25, ±50, ±100, and ±150ppm/°C, and four tolerance values: 5%, 1%, 0.5%, and 0.1%. However, all of these standard offerings may be customized to suit individual application requirements.
Operating temperatures for the series span -55°C to +125°C, rated voltage is 125VDC (max.), and parts are shipped in waffle pack. Lead-time for the series is currently eight weeks.