Power Electronics
Sherlock 4.0 Adds Powerful New Modeling Features

Sherlock 4.0 Adds Powerful New Modeling Features

DfR Solutions announced the release of the most advanced version of Sherlock Automated Design Analysis™ software, version 4.0.  The newest version of Sherlock allows users to model complex PCBs and components with exceptional detail, strengthening design decisions, saving significant time and money.  Advanced features include an increased suite of FEA integration tools, lead modeling of surface mount and thru-hole components, substrate trace modeling, shock scoring, an expanded cutout editor, and a heatsink editor.

The combination of Substrate Trace Modeling and a deeper integration with Abaqus and ANSYS® Workbench™ is the most powerful enhancement to the Sherlock software. This one-two punch allows for more rapid and detailed modeling of all substrate features, providing thermal/mechanical simulation teams at component companies much deeper insight into challenges with next-generation IC packaging, such as coreless substrates, ultra-thin BGAs (less than 1 mm thickness), multi-stack filled micro-vias, and 3D packaging.

Sherlock's Lead Modeler and Heatsink Creator now allow the user to automatically specify lead structures and heatsink architecture and attach for all electronic parts. These two new features along with the new Shock Scoring enable OEM engineers to assess performance of electronics that are subjected to repeated shock, such as door and trunk-mount electronics in automotive applications and wearable electronics embedded in athletic gear.

Sherlock is the first-of-its-kind Automated Design Analysis software for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level. Sherlock continues to evolve, incorporating new innovations and enhancements allowing users to manage increasingly complex analyses faster and more efficiently than ever before.

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