API Technologies Corp. now offers durable, low pressure overmolded backshells on connector interfaces from its Electromagnetic Integrated Solutions (EIS) product line, the leader in EMI/RFI components and interconnects. This simplified backshell design is readily available and more cost-effective than its metal counterpart.
Ideal for use in military, aerospace, high-end industrial, oil and gas, as well as medical applications, these durable, waterproof and weather resistant backshells offer improved reliability and a simplified specification process. There is no hard tooling required for MIL-DTL-38999 or many other standard connector interfaces and minimal tooling charges for custom configurations.
API's proprietary overmolding technology offers superior strain relief and is designed to withstand high temperatures and harsh environments. The backshell's molding material electromagnetically shields the cable and offers improved insulation between conductors and the conductor shell.
The overmolded backshell design encapsulates all internal wiring as well as the shield and jacket, ensuring waterproof termination. The mold material penetrates to the connector insert, locking all wires and contacts in place. Contacts will not recess under mechanical stress eliminating the possibility of insulation damage and short circuiting. These overmolded backshells can reduce cost by approximately 50% compared to standard metal backshells.