Vicor has created an expanding library of V•I Chip application notes to support the implementation of power system designs. The comprehensive family of V•I Chip components, composed of BCM converters, PRM regulators and VTM current multipliers, is now complemented by design guidelines and technical details for a number of key applications and processes. These application notes give power designers practical knowledge and insights to ensure their access to all of the advantages that Factorized Power Architecture (FPA) offers.
Notes cover the creation of current-sharing parallel arrays for high-power, low-voltage applications using PRM and VTM pairs. Also covered are the design practices for powering multiple VTMs with a single PRM to meet the challenge of power systems requiring lower voltages, more current, and multiple voltages within one system.
For the BCM, one application note describes basic design practices for using a BCM as an intermediate bus converter to provide a bus voltage to low-power niPOLs. Another offers a filter solution. Yet another is devoted to thermal management to easily determine the power capability of the BCMs given a certain ambient temperature, airflow conditions and heatsink options. The technical details include 27 pages of diagrams, equations, IR images, curves providing thermal impedance, power derating and maximum ambient temperature details for individual BCMs.
Application note guidelines are also provided for pc board layout, enabling system density to keep pace with technology by providing layout flexibility and high power density while ensuring a quiet, efficient, and dense system. In another application note, V•I Chip soldering recommendations are given that define the processing conditions required for successful attachment to a pc board.
The application notes are available under the Vicor web site, specifically located at http://www.vicorpower.com. Chinese language versions will be available on the web site in February.