AVX Corp. has made several new customization options available for its SMX Series Stacked SMPS MLCCs. The various customization options, which include custom geometries, packages, terminals, lead configurations, and stress relief mounting options, allow engineers to achieve higher efficiency, space-saving designs with enhanced mechanical and thermal reliability. Additional benefits available through customization include wholly eliminating soldering requirements by enabling direct electrical and mechanical connection to the circuit and eliminating the risk of thermal shock by enabling remote soldering further from the ceramic capacitor case.
SMX Series MLCCs exhibit excellent high frequency performance and high current handling capabilities in addition to low ESR, ESL, and DC leakage. Available with voltage ratings spanning 25 V to 500 V, capacitance values up to 270 µF, and both C0G and X7R dielectrics, SMX Series MLCCs also exhibit rugged mechanical shock and vibration capabilities and a wide frequency response in high pulse, high current, and high temperature applications up to +200°C.
Constructed using high temperature solder to ensure reliable operation in harsh environments, SMX Series MLCCs are ideal for down-hole oil exploration, including logging while drilling and geophysical probes, in addition to a variety of space, aerospace, and underhood automotive applications. The series is also well suited for DC filtering in high power, high frequency motor drives, high pulsed-current circuitry, and a range of low power electronics.
AVX's SMX Series MLCCs are included in the component catalog of its SpiCalci 8.0 modeling software, which allows design engineers to quickly and easily simulate performance characteristics for output data including: temperature vs. applied current, ESR and impedance vs. frequency, maximum current vs. frequency, maximum ripple voltage vs. frequency, and phase angle vs. frequency. To download the SpiCalci 8.0 executable file, please visit: http://www.avx.com/SpiApps/default.asp#spicalci.