Power Electronics
Power Package Enables Increased Power Density

Power Package Enables Increased Power Density

Vishay’s miniature package type for its Trench MOS Barrier Schottky (TMBS) and planar Schottky rectifiers enables higher-current-density power supply designs with its compact dimensions and ability to handle up to 100 V and 12 A. With a 1.1-mm height and 4.8-mm by 6.7-mm footprint, the new devices in the SMPC package are designed to provide more power in a smaller space for applications including secondary rectifiers and freewheeling circuitry for ac-dc and dc-dc converters.

The three TMBS rectifiers in the SMPC package released today feature voltage ratings up to 100 V and high current power densities of 8 A to 12 A. The 16 new planar Schottky rectifiers provide voltage ratings from 20 V to 100 V, and high current power densities from 3 A to 10 A. As shown in the table, all the devices feature a very low forward voltage drop, and special wide-bottom plate designs that provide high heat dissipation.

The single- or dual-chip, surface-mount SMPC (TO-277A) package of these new rectifiers features solder pads that are compatible with other SMD devices, so no modification is needed to the PCB layout when they are used as higher-performing upgrades to existing devices. Pricing in 1000-piece quantities is $0.25 per piece for the SS10P4.

SMPC Rectifier Specifications Summary Table

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