Power Electronics

Partnership Targets Wire-Bondable Passives

IRC’s Advanced Film has franchised Semi Dice as a distributor for its wire-bondable product offering. Available on both silicon and ceramic substrates, IRC offers wire-bondable precision resistors, voltage-divider networks, resistor-network arrays, chip capacitors, chip-resistor and chip-capacitor circuits, and multi-tap chip-resistor networks.

IRC’s wire bondable devices are being specified for use in hybrid modules and battery-operated miniature devices. The wire-bondable components utilize the TaNFilm and TaNSil processes, which produce an ultra-stable self-passivating tantalum-nitride resistance element that provides good stability, power dissipation and precision.

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