I/O Fabric Generator Spins Complex SoC Designs

June 16, 2008
The Spinner I/O fabric generation tool for automated, bug-free I/O fabric synthesis of complex SoCs is said to automatically generate and validate the RTL for the complete I/O layer of an IC from a single-source specification.

The Spinner I/O fabric generation tool for automated, bug-free I/O fabric synthesis of complex SoCs is said to automatically generate and validate the RTL for the complete I/O layer of an IC from a single-source specification. Using the tool’s so-called “Perfect By Construction” methodology, SoC designers can eliminate I/O bugs and greatly simplify the integration effort—with up to three-times fewer resources, five-times schedule reductions, and radically improved quality through sign-off level collaboration on incremental changes, accordion to Duolog Technologies.

The Spinner is intended to address the spiraling complexity of SoC I/O integration, which finds design teams under enormous pressure to deliver bug-free designs the first time around. I/O design bugs can delay system validation, and silicon bugs can kill the chip. At 45 nm, one respin typically costs more than $4 million, and a three-month respin delay can result in loss in revenue.

Duolog’s Spinner enables a fully automated, bug-free 1-Click Release with standardized tool interfaces, extensive coherency checking and a powerful generator framework that delivers bug-free code and specifications.

Spinner’s advanced I/O fabric generation features include:

  • IP-XACT compliant interfaces for core, chip, die, and package as well as I/O layer primitives, such as I/O, DFT and BSR cells;
  • Complete SoC I/O layer specification IDE for pin muxing, I/O-cell control, BSR and package definition;
  • Coherency checking to perform an exhaustive range of checks on the I/O specification;
  • Auto-generation of I/O fabric RTL, documentation, validation and software views and IP-XACT interfaces.

Eclipse-based Spinner runs on Windows, Linux, or Solaris and is highly interoperable with existing design flows through standards-based interfaces. The tool is available now with multiple licensing options; contact Duolog directly for pricing information.

Duolog Technologies
www.duolog.com

Sponsored Recommendations

TTI Transportation Resource Center

April 8, 2024
From sensors to vehicle electrification, from design to production, on-board and off-board a TTI Transportation Specialist will help you keep moving into the future. TTI has been...

Cornell Dubilier: Push EV Charging to Higher Productivity and Lower Recharge Times

April 8, 2024
Optimized for high efficiency power inverter/converter level 3 EV charging systems, CDE capacitors offer high capacitance values, low inductance (< 5 nH), high ripple current ...

TTI Hybrid & Electric Vehicles Line Card

April 8, 2024
Components for Infrastructure, Connectivity and On-board Systems TTI stocks the premier electrical components that hybrid and electric vehicle manufacturers and suppliers need...

Bourns: Automotive-Grade Components for the Rough Road Ahead

April 8, 2024
The electronics needed for transportation today is getting increasingly more demanding and sophisticated, requiring not only high quality components but those that interface well...

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!