Power Electronics

Second Source for MOSFET Package with Double-Sided Cooling

STMicroelectronics and Siliconix, a subsidiary of Vishay Intertechnology, have concluded an agreement whereby ST will license Siliconix’s PolarPAK, a power MOSFET packaging technology that provides cooling through the top and bottom sides of the package. PolarPAK uses a lead frame and plastic encapsulation similar to those used for most standard power MOSFET packages, ensuring good die protection and easy handling in manufacturing. At the same time, the PolarPAK package’s dissipates heat so efficiently that it can handle twice the current of a standard SO-8 within the same footprint dimensions.

"Advances in packaging need to be developed in tandem with silicon technology improvements,” said Ian Wilson, manager of the Power MOSFET Division, STMicroelectronics. “The PolarPAK package, with its superior thermal handling capability, represents a remarkable evolution in assembly technology, allowing designers to increase efficiency and power density. This package technology will complement ST's range of STripFETTM MOSFETs optimized for power conversion in computer, datacom and telecom applications."

"By working together with Siliconix, we will achieve the greater market acceptance of this new package necessary to enable cost-effective solutions," said Carmelo Papa, corporate vice president and general manager of the Microcontroller, Linear and Discretes Product Group, STMicroelectronics.

For more information, visit www.vishay.com or www.st.com.

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