Power Electronics

Power MOSFET Package is Smaller, Thinner TSSOP

Toshiba America Electronic Components Inc. (TAEC) has announced TSSOP Advance, a new smaller packaging technology that extends the company's diverse packaging options for power MOSFETs. Developed by Toshiba Corp. (Toshiba), the TSSOP Advance package is approximately 53% thinner, at 0.75 mm (typ.), and requires an approximately 45% smaller mounting area than industry-standard SOP-8 packages. The TSSOP Advance package, combined with Toshiba's Ultra High Speed U-MOS III (UHS U-MOS III) process technology, increases power dissipation approximately 20% compared to standard SOP-8 packaging, and enables high-speed switching and very low drain source on-state resistance (RDS (ON)).

The first device offered in TSSOP Advance packaging is the Toshiba TPCM8001-H, a 30-V, 20-A power MOSFET targeted for space-constrained synchronous rectification applications in dc-dc converters and in power supplies for mobile computers and portable electronics equipment. In addition, Toshiba has announced eight new higher voltage power MOSFETs, ranging from 40 V to 250 V in the company's SOP Advance packaging, first introduced in Sept. 2003.

Toshiba's TSSOP Advance packaging is only 0.75 mm (typ.) in height, which equates to approximately a 53% reduction in thickness compared to industry-standard SOP-8 packaging, and is approximately 21% thinner than Toshiba's SOP Advance packaging. The new package has a compact 3.6-mm × 4.6-mm footprint area and uses flat, lead (Pb)-free Finish1 terminals connected to a spreader to improve thermal resistance, reduce package resistance loss and enable higher current output.

Samples of Toshiba's TPCM8001-H 30V TSSOP Advance power MOSFET are available now, priced at $0.45 each. Production quantities are scheduled for availability in January 2005.

For more information, visit chips.toshiba.com.

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