The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2015 titled, "Substrate Embedded Components Enabling High Density 3D Power Packaging." Featuring speakers from leading industry and research organizations, the session will present proven and available techniques to implement 3D embedded component packaging in today's power supplies. The PSMA-sponsored session will take place on Wednesday, March 18, 2015, from 2:00-5:30 p.m. at the Charlotte Convention Center in Charlotte, North Carolina.
The power supply industry is continually challenged to increase power density while lowering cost -- and 3D packaging technologies may provide valuable options. 3D packaging utilizing embedded components (actives and passives) in both organic and non-organic substrates is proving to be the technology with the fastest time to market for increased power density in a smaller footprint. It is already in production in semiconductor, component and power supply designs.
The presenters for the industry session on 3D packaging (IS08) will explore these topics and will offer insights to help attendees anticipate and identify potential opportunities to enable their companies to participate this emerging technology. The speakers will represent AT&S, Sarda, GaN Systems, LTEC, Intel, and the PSMA Packaging Committee.
Co-chairs of the session, Ernie Parker of Crane Aerospace & Electronics and Brian Narveson of Narveson Consulting, stated: "This industry session will not only be very informative but will also provide an opportunity for attendees to interact with other professionals who are active in the evolving application of 3D embedded component packaging in sub-assembly and power supply designs. We encourage people to register for APEC 2015, to make plans to attend this session on 3D packaging, and to consider participating in the other PSMA-sponsored meetings during the week."