To meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor developed the Dual Cool(tm) packaging for MOSFETs. The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology that enables additional power dissipation through the top of the package.
Dual Cool packaging features an exposed heat slug that delivers a significant reduction in thermal resistance from junction to top of case, resulting in more than 60 percent higher power dissipation capability than standard PQFN packaging when a heat sink is mounted. Additionally, MOSFETs in the Dual Cool package are designed with Fairchild's proprietary PowerTrench® process technology, that enables lower RDS(ON) and higher load currents in smaller package sizes.
Unlike competitive top-side cooling solutions, these devices are currently available in both Power33 (3.3mm x 3.3mm) and Power56 (5mm x 6mm) Dual Cool packaging options. Maintaining the same industry-standard PQFN footprint, the Dual Cool package allows power engineers to rapidly qualify MOSFETs in Dual Cool packaging, gaining increased thermal efficiency without having to adjust for non-standard packages.
Devices currently available in the Dual Cool package include the FDMS2504SDC, FDMS2506SDC, FDMS2508SDC, FDMS2510SDC (5mm x 6mm footprint) and the FDMC7660DC (3.3mm x 3.3mm footprint). These devices are ideal as synchronous rectifying MOSFETs for DC-DC converters, telecom secondary side rectification and high end server/workstation applications. Fairchild's Dual Cool packaged MOSFETs' top-side cooling and an ultra-low junction temperature (R?JA) enable increased thermal efficiency. MOSFETs in the Dual Cool package can be used with or without a heat sink.