Dual Cool Package Improves Power Density and Performance in DC-DC Power Applications

Dual Cool Package Improves Power Density and Performance in DC-DC Power Applications

Fairchild Semiconductor's mid-voltage PowerTrench® MOSFETs with Dual Cool™ packaging technology are well suited to aid DC-DC converter  design challenges of improving power density while saving board space and reducing thermal resistance.

Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.

Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60V FDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications.

All devices in this product family are available in a PQFN 5x6 8L package and are priced at:

  • FDMS8320LDC (40V): $1.09
  • FDMS86500DC (60V): $1.16
  • FDMS86300DC (80V): $1.16
  • FDMS86101DC (100V): $1.09\

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