Power Electronics

Vicor Expands DCM DC-DC Converter Module Series

At APEC, Vicor Corporation announced expansion of its DCM Converter Module Series of isolated, regulated DC-DC converters within Vicor's Converter housed in Package™ (ChiP) power component platform. This series now covers critical applications in Aerospace, EV/HEV, Rugged Systems, Industrial, and Telecom/Datacom. DCMs provide nominal input voltages of 24, 28, 48, 270, 290, and 300 Volts with nominal outputs of 48, 36, 28, 24, 15, 12, and 5 Volts and are available in packages with up to 600 Watts of power. DCMs can be coupled with Vicor FPATM and/or ZVS regulators enabling full power solutions that deliver dense, efficient, and scalable source-to-load power. Designers can couple DCMs downstream with Vicor's ChiP and SiP (system in package) point-of-load regulators, thereby enabling an integrated, complete power solution delivering dense, efficient, and scalable source-to-load power.  Such a combination of differentiated products, reflecting Vicor's Power Component Design Methodology, provides unsurpassed performance, ease of use, and total cost of ownership.

By utilizing Vicor's DC-ZVS topology within the DCM Series, 93% typical efficiency can be achieved, along with power density exceeding two times that of conventional DC-DC converters. With power density up to 1,244 W/in3, DCMs enable engineers to optimize end systems for size, space, and weight.  In addition, up to eight DCMs can be paralleled in an array without derating or additional circuitry.  When configured in such an array, up to a 4.8 kW DC-DC solution can be achieved.

Vicor's DCMs are available in two through-hole packages: a 4623 (46 x 23 mm) ChiP package capable of up to 600 W of power and a 3623 (36 x 23 mm) ChiP package capable of up to 320 W of power.

Vicor's ChiP platform sets best-in-class standards for a new generation of scalable power modules. Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiPs provide superior thermal management supporting unprecedented power density. Thermally-adept ChiPs enable customers to achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably. The advent of ChiPs embodies a modular power system design methodology enabling designers to achieve high performance, cost-effective power systems from AC or DC sources to the point of load using proven building blocks.

Pricing starts at $82.14 in 1,000 unit volumes for the 3623 ChiP packaged device.

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