Power Electronics

Data Points

IRC Develops Thick Film Technology

TT electronics IRC recently expanded its offering of thick-film technology, providing design engineers with a greater variety of flexible and reliable choices to accommodate nearly any design. IRC supplies the latest in thick film resistor systems on the designer's choice of substrate. With more than 25 choices in system materials and a range of advanced processes available, IRC supports application-specific and custom configurations.

Various materials are available for use within each of four systems based on the substrate: the Organic Materials system, Ceramic Air-fired system, Ceramic nitrogen-fired system and the Anotherm (printed circuit direct to heat sink) Aluminum system.

For more information, visit IRC's Web site at www.irctt.com.

Plug-and-Play Absolute Encoder Cuts Assembly Time By Half

Agilent Technologies Inc., Palo Alto, Calif., has unveiled its newest high-speed plug-and-play absolute encoder for industrial automation applications. According to the developer, it's the smallest 16-bit plug-and-play encoder in the industry. It's crafted to reduce assembly time by half, and cut costs by as much as 40%.

The AEAS-7000 uses a module approach that reduces the number of assembly steps to four, compared with other approaches that require as many as eight steps. It also reduces the number of components needed from approximately 80 to as few as four — decreasing inventory, manufacturing, and purchasing costs. In addition, it eliminates the need for multiple alignment adjustments with its industry-first plug-and-play feature.

Other features include 5-encoder resolution options in one compact package, 16-MHz serial data output for high-speed applications such as servo motors up to 12,000 rpm, elimination of manual hunting for most and least significant bits (MSB & LSB), and serial synchronous 4-wire interface. It also offers Grey code correction to ±1 LSB, which decreases codewheel misalignment.

Absolute encoders are used in machines that need information about the position of components before any motion occurs. The AEAS-7000 is capable of resolutions ranging from 12 bits to 16 bits. The total current consumption for the encoder is approximately 21 mA. Expected to go into production next month, it's targeted at servo motors, robotics, machine tools, and wafer handlers.

For more information, visit www.agilent.com/go/news.

Flexible Package Accomodates More Chips

Motorola's latest power quad flat pack no-lead (PQFN) package overcomes the limitations of existing power packages, meeting the high power dissipation requirements of automotive, industrial, marine, and commercial applications. Thus, the surface-mountable PQFN can accommodate more chips into a single package.

The PQFN solution uses minimum board space while providing excellent electrical and thermal characteristics. The use of a 20-mil thick copper lead frame and heavy gauge aluminum bond wires helps transfer heat from the package while providing low electrical on-resistance. Conduction is the primary mode of heat transfer that moves the generated heat away from the die surface and out of the package through exposed heat sinks on the bottom surface of the PQFN.

Advantages over existing PQFN packages and power IC packages include leadless package, proven solder joint reliability when surface mounted to PCB boards, a cost-effective solution for multichip power products, environmentally preferred packaging materials, a MAP process that allows electrical and physical flag isolation of multiple die, superior thermal performance with 20-mil-thick copper lead frame, and very low contribution to electrical on-resistance.

Motorola is working on more than 20 configurations of the PQFN package, with lead counts ranging from 16 to 35. Custom versions will be available. Motorola has applied for JEDEC registration for its line of standard PQFN-S platform products, ranging in size from 5 mm to 12 mm.

The first product is the MC33982 self-protected silicon switch. This 2 mΣ high-side power switch is housed in a 12 mm × 12 mm PQFN.

For more information, visit www.motorola.com.

Powervar Receives Safety Certification

Powervar, Waukegan, Ill., has received formal certification under “SEMI S2-0200” for its Global Power Interface (GPI) Series 2000 family of 3-phase power conditioners. SEMI S2-0200 certification means the 3-phase power conditioning systems have met stringent safety guidelines for use in the semiconductor industry.

The series has 19 standard models for North America and 19 more for international installations in sizes from 10kVA to 300kVA. North American models from 10kVA to 175 kVA are UL listed, and models from 185 kVA to 300 kVA are built to UL standards. All models carry the CE mark.

For more information, visit www.powervar.com.

Power MOSFETs Offer Better Performance

Silicon Semiconductor Corp.'s (SSC) four new 30V Power MOSFET products, including two JBSFETs with integral Schottky diodes, comprise the first offering of power conversion products optimized for use in polyphase dc-dc converter circuits.

The new synchronous low-side and control high-side power JBSFETs provide industry-best performance for this application, with an improvement of 200% to 300% in RDS(ON)*QG, and RDS(ON) *Qsw products. SSC's performance improvement using its patented, rugged planar process translates into a significant improvment over conventional power MOSFETs.

Ultralow Rds(on) combined with dramatic reduction in gate and switching charges enable 2MHz switching while the integral high-current JBS (Junction Barrier Schottky) essentially clamps off the body diode resulting in negligible conduction and reverse recovery losses.

For more information about these power MOSFET products, visit www.siliconsemi.com.

The Double-P footprint incorporates two extra power pins so that the maximum current per pin is below 50A, with a preference for a maximum of 40A. The two extra pins improve manufacturability, performance, and reliability.

For more information, visit www.ericsson.com.

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