Tiny Complementary MOSFET
Fairchild Semiconductor's FDC-6020C integrates two MOSFETs into one SuperSOT-6 FLMP, a package that occupies just 9 mm2 of board space. Despite its tiny footprint, the MOSFET pair can deliver greater than 1 A of continuous current in point-of-load dc-dc converters (POLs). This device can replace other complementary MOSFET solutions that use either two devices or a larger footprint package.
The FDC6020C's low gate threshold voltage (VGS = 2.5 V) simplifies designs using 3.3-V bus converters or single-cell Li-ion batteries. This capability eliminates the need for charge pump circuits when higher gate-drive voltages are unavailable. Additionally, the device features low on-resistance. RDS(on) is specified at 52 mΩ for the p-channel FET and 27 mΩ for the n-channel FET, each at 4.5 V.
With its thermally enhanced package, the FDC6020C achieves a junction-to-case thermal resistance of (1°C/W) and a junction-to-ambient thermal resistance of 68°C/W. In addition, the SuperSOT-6 FLMP is lead-free (Pb-free). In quantities of 1000, unit pricing for this device is $0.76.
A datasheet of this product is available at www.fairchildsemi.com/ds/FD/FDC6020C.pdf.
15-V Ultracapacitor Packs
Using the D-cell packaged ultra-capacitors it introduced last year, Maxwell Technologies has developed a series of 15-V BOOSTCAP ultra-capacitor packs and modules. Designed to replace or supplement batteries, the packs and modules provide easy-to-integrate energy-storage and power-delivery solutions for many consumer and industrial electronics and transportation applications.
The packs and modules each incorporate six BOOSTCAP BCAP0350 ultracapacitor cells, and give system designers “plug and play” 15-V building blocks that can supplement or replace 12-V batteries in electronic systems with varying voltage and current requirements. The packs and modules also may be strung together to create energy-storage units rated for hundreds of volts.
Both the packs and modules incorporate active or passive cell balancing and pack-to-pack or module-to-module balancing. The packs are enclosed in lightweight shrink-wrap plastic packaging, while the modules are enclosed in a rugged aluminum chassis. In each case, the units are rated for 58 F at 15 V, which corresponds to 6525 J of energy storage. Unit volume ranges from 0.6 l for the packs to 0.7 l for the modules with corresponding masses of 500 g and 680 g. The latter values result in a power density of about 3000 W/kg.
The 15-V BOOSTCAP BCAP0350 packs will be priced at $127, and modules will be priced at $200 in quantities of one to 15 units.
For more prodcut information, see www.maxwell.com.
Power Management IC for Consumer Products
A number of ICs have been developed to address the complex power management requirements of communications designs. However, a new device from Summit Microelectronics is the first in a family of chips that provides similar functionality for consumer applications. The SMB120 9-channel programmable dc-dc converter targets products such as digital still cameras/camcorders, DVD/MP3 players/recorders, handheld and automotive GPS terminals, PDAs, portable LCD TVs, as well as the next generation of mobile phones.
Using the SMB120, designers can digitally program a multi-output power supply and its associated power management functions with a few clicks of a mouse. This contrasts with the conventional approach, which typically requires iterative hardware design of analog power solutions. The SMB120 uses the I2C bus as a management bus, providing a digital, simple-to-use GUI software-driven programming interface.
The SMB120's nine channels of power conversion consist of four buck converters, three boost converters, one inverting buck/boost converter and one LDO regulator. All PWM channels are digitally programmable for output characteristics and monitoring, including voltage output levels to ±0.5% accuracy. Additionally, the chip can independently sequence on and off each output with precisely controlled timing and slew rate, and program or arbitrarily adjust “on-the-fly” (margining) output voltages.
Additionally, complete power system diagnostics and monitoring is provided via the digital interface with SMB120 configuration data stored in on-chip EEPROM memory.
The SMB120 operates from a +2.7-V to +5.5-V input. Available in a 64-pad QFN, the IC is priced at $5.95 each in lots of 1000.
For more product details, visit www.summitmicro.com.
PowerDsine recently announced that the Institute of Electrical and Electronics Engineers (IEEE) has formed a new 802.3 Study Group to discuss the enhancement of IEEE 802.3af, the Power-over-Ethernet (PoE) standard. The purpose of the enhanced PoE standard, dubbed “PoEplus,” is to deliver higher power levels to devices that require more than the 13 W currently specified in the 802.3af standard, which was ratified in June 2003.
During the Call for Interest at the IEEE 802 Plenary Meeting in San Antonio, Texas, PowerDsine gave a presentation outlining market drivers for higher power PoE and how new enhancements are vital to the continued success of PoE technology.
The main objectives of the new IEEE 802.3 Study Group are to ensure all new modifications are compatible with the IEEE 802.3 Ethernet standard and backwards compatible with existing IEEE 802.3af PoE equipment.
For more information, visit www.powerdsine.com.
At the 2004 IEEE's International Electron Devices Meeting in December, scientists from Infineon Technologies AG and the Technical University of Munich jointly presented a new scalable transistor concept that enables low-voltage digital and analog circuits. For the first time, complementary tunneling field effect transistors (TFETs) can be fabricated in a standard silicon process with good performance for static and dynamic parameters.
This discovery promises to help overcome hurdles to scaling CMOS technology to feature sizes below 45 nm. The new technology also could pave the way for ultra low-voltage analog circuits.
For additional information, see www.infineon.com