Power Electronics
Low-Cap Silicon ESD Devices

Low-Cap Silicon ESD Devices

TE Circuit Protection announces a family of eight new single-channel and multi-channel silicon ESD (SESD) protection devices offering the lowest capacitance (bi-directional: 0.10pF typical; uni-directional: 0.20pF typical), highest ESD protection (20kV air and contact discharge) and smallest size (multi-channel: smallest flow-through form-factor and 0.31mm height) packages available on the market.

The devices' ultra-low-capacitance results in the industry's lowest insertion loss, which is essential for maintaining signal integrity in ultra-high-speed applications. The devices help protect against damage caused by electrostatic discharge (ESD), surge and cable discharge events. The multi-channel devices also feature a flow-through design package that allows for matched impedance of PCB trace routing, which is essential for maintaining high-speed signal integrity. The ultra-low-capacitance, small size and high ESD kV rating of the SESD devices are well-suited for smart phones, HDTVs and similar consumer, auto and other markets' products using today's - and tomorrow's - highest-speed interfaces such as USB 3.0/2.0, HDMI, eSATA, DisplayPort, and Thunderbolt.

The single- and multi-channel SESD devices also feature an industry-leading 20kV contact and air discharge rating, exceeding IEC61000-4-2's 8kV industry standard. In the event of a high voltage ESD strike, this high kV rating helps minimize the risk of the ESD device failing short and permanently disabling the port, or open, exposing the downstream chipset to damage caused by another ESD strike. This capability helps reduce customer complaints and warranty repair costs.

Consumer electronics are constantly shrinking and TE Circuit Protection's SESD devices offer size advantages in the ongoing trend for miniaturization. The single-channel devices are available in 0201-sized XDFN small footprint (0.6mm x 0.3mm x 0.31mm) and 0402-sized XDFN (1.0mm x 0.6mm x 0.38mm) packages. The multi-channel SESD arrays (two-, four- and six-channel options) feature a package height as low as 0.31mm- resulting in up to a 50% lower profile than comparable devices. The SESD devices' lower profile allows for placement closer to the edge of the PCB, or in-between boards and connectors, facilitating design flexibility.

  • Price: Unit pricing starting at $0.16 for 10,000 unit quantities
  • Availability: Now
  • Delivery: 12 weeks ARO

TE Circuit Protection
Part Number: SESD

Hide comments

Comments

  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.
Publish