Because of their high ESL compared to ceramic, tantalum capacitors are not the optimum choice for high frequency decoupling. Paralleling tantalum capacitors for bulk capacitance...
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The second part of this feature on controlling EMI in power supply boards explores the challenges posed by external switch drive signals and the effectiveness of shielding techniques...
Significant efforts have been made to show the performance improvements achievable with eGaN® FETs over silicon MOSFETs in both hard and soft switching applications. This volume...
PC-board layout sets the functional, electromagnetic interference (EMI), and thermal behavior of a power supply. Good layout from first prototyping on actually saves significant...
SiC properties are recognized as being advantageous for fabrication of power devices. Although substrate costs and defect densities are decreasing, SiC is not yet as mature and...
The choice of IGBTs presents a challenge in balancing the potential for power losses at higher switching frequencies resulting in heat or reduced control precision at lower switching...
Reducing electronic system power consumption may be a goal today, but product performance, reliability, and cost cannot be ignored. Lower power levels can cause reduced performance...
Today, energy-autonomous wireless systems are found in many applications – including building automation, industrial plants and many other sectors. The first wireless standard...
To ensure long-term reliable operation it is essential to select the proper uninterruptible power supply (UPS) for use in harsh wide temperature environments. To make sure of ...
